Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

Publisher:
International Electrotechnical Commission - Technical Report

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

Edition :	1.0
File Size :	1 file , 2.9 MB
Note :	This product is unavailable in Russia, Belarus, Ukraine, Canada
Number of Pages :	24
Published :	10/14/2019

IEC/TR 60286-7 Ed. 1.0 b:2019 PDF

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

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